maf00008kem mn103s52 series type MN103S52G mn103sf52g internal rom type mask rom flash rom (byte) 128k ram (byte) 4k package (lead-free) qfp100-p-1818b qfp100-p-1818f minimum instruction execution time 25 ns (at 4.3 v to 5.5 v, 10 mhz internal regulator used) 25 ns (at 3.0 v to 3.6 v, 10 mhz) ? interrupts 9 external interrupts 42 internal interrupts: watchdog timer. timer. serial i/f. pwm. a/d conversion ?nish. system error ? timer counter 8-bit timer 8 timer 0 to 7 ........... interval timer. event count. cascading connectable 16-bit timer 4 timer 8 .................. interval timer. event count. pwm output ( 6 pins simultaneous output are available). double buffer timer 9, 10 ............ interval timer. event count. pwm output. double buffer timer 11 ................ interval timer. double buffer. start synchronized with 3-phase pwm are available watchdog timer 1 ? serial interface uart (full duplex) /synchronous interfaces selective 3 serial 0, 1 ............... 7-bit, 8-bit transmission serial 2 ................... 1-bit to 8-bit transmission (synchronous). 2 and 3 channel type selectable (synchronous) ? extended calculation multiply and accumulate arithmetic. multiplication. saturated arithmetic ? i/o pins i/o 56 : exclusive 8. common use 48 input 16 : common use 16 ? a/d converter 10-bit 3 unit. 2 channels 2. 12 channels 1 simultaneous conversion of 3 series are available. with s/h conversion start synchronized with 3-phase pwm or timer 11 are available ? motor control pwm 16-bit 3-phase pwm 1 minimum resolution: 50 ns triangular waveform or jigsaw waveform. dead time setup. double buffer. output polar switching is available. pwm output pin protect function ? notes 5 v single power supply (internal regulator) ? rom correction correcting address designation: up to 4 addresses possible ? electrical charactreistics (a/d converter characteristics) parameter symbol condition limit unit min typ max non-linear error 10-bit 3 lsb a/d conversion time tad 1.5 s analog input voltage via vref- vref+ v ta = 25 c. vdd = 5.0 v. vss = 0 v maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://panasonic.net/sc/en
maf00008kem MN103S52G, mn103sf52g ? development tools in-circuit emulator px-ice-103s52 ? pin assignment qfp100-p-1818b, qfp100-p-1818f p70 p71 p72 p73 p74, irq0 0 p75, irq0 1 p76, irq0 2 p77, irq0 3 p80, adin00 p81, adin01 p82, adin10 p83, adin 11 vs s vref- p84, adin20 vref+ vd d p85, adin21 p86, adin22 p87, adin23 p90, adin24 p91, adin25 p92, adin26 p93, adin27 p94, adin28 p13, irq0 7 p12, irq0 6 p1 1, irq0 5 p10, irq0 4 p07, nrst vs s lo n vd d vd d vout vout vdd2 pvdd tcpou t pvss vs s osci osco vd d test 1 test 2 test 3 p97, adin31 p96, adin30 p95, adin29 p42, tm9ai p41, tm8bio p40, tm8aio p37, tm7io p36, tm6io p35, ym5io vdd p34, tm4io vss p33, tm3io p32, tm2io p31, tm1io p30, tm0io p27, sbi 0 p26, sbt0 p25, sbo 0 p24, sbi 1 p23, sbt1 p22, sbo 1 p21, sbi 2 p20, sbt2 p17, sbo 2 p1 6 p1 5 p14, irq08 p43, tm9bi p44, tm9ao p45, tm9bo p46, tm10ai p47, tm10bi vpp vdd 2 p50, tm10ao vss p51, tm10bo vdd p52, pwm00 p53, npwm00 p54, pwm01 p55, npwm01 p56, pwm02 p57, npwm02 p6 0 p6 1 p62, pwm10 p63, pwm 11 p64, pwm12 p65, pwm13 p66, pwm14 p67, pwm15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805
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